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    Please use this identifier to cite or link to this item: http://ir.nhri.org.tw/handle/3990099045/12448


    Title: Cysteine-capped hydrogels incorporating copper as effective antimicrobial materials against methicillin-resistant staphylococcus aureus
    Authors: Yang, JJ;Huang, YC;Chuang, TH;Herr, DR;Hsieh, MF;Huang, CJ;Huang, CM
    Contributors: Immunology Research Center
    Abstract: Methicillin-resistant Staphylococcus aureus (S. aureus) (MRSA) has become an alarming threat to public health, and infected soft tissue. Antibiotics are commonly used to treat skin infection with MRSA, but the inappropriate use of antibiotics runs a considerable risk of generating resistant S. aureus. In this study, we created a cysteine-capped hydrogel able to absorb and release copper, an ion with the capability of suppressing the growth of USA300, a community-acquired MRSA. The results of analysis of Fourier transform infrared spectroscopy (FTIR) revealed the binding of copper to a cysteine-capped hydrogel. The topical application of a cysteine-capped hydrogel binding with copper on USA300-infected skin wounds in the dorsal skin of Institute of Cancer Research (ICR) mice significantly enhanced wound healing, hindered the growth of USA300, and reduced the production of pro-inflammatory macrophage inflammatory protein 2-alpha (MIP-2) cytokine. Our work demonstrates a newly designed hydrogel that conjugates a cysteine molecule for copper binding. The cysteine-capped hydrogel can potentially chelate various antimicrobial metals as a novel wound dressing.
    Date: 2020-01-21
    Relation: Microorganisms. 2020 Jan 21;8(2):Article number 149.
    Link to: http://dx.doi.org/10.3390/microorganisms8020149
    JIF/Ranking 2023: http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=NHRI&SrcApp=NHRI_IR&KeyISSN=2076-2607&DestApp=IC2JCR
    Cited Times(WOS): https://www.webofscience.com/wos/woscc/full-record/WOS:000519618200006
    Cited Times(Scopus): https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85078740633
    Appears in Collections:[莊宗顯] 期刊論文

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